Publication | Closed Access
On-chip interconnect trends, challenges and solutions: How to keep RC and reliability under control
23
Citations
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References
2016
Year
Unknown Venue
EngineeringComputer ArchitectureInterconnection Network ArchitectureInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors)NanoelectronicsElectronic PackagingMaterials Science3D Ic ArchitectureElectrical EngineeringChallenges Simultaneous OptimizationNovel Metallization SchemesComputer EngineeringInterconnection NetworkNetwork On ChipMicroelectronicsOn-chip Interconnect TrendsNew Materials
Interconnects pose increasing challenges as technology scaling proceeds. In order to overcome these challenges simultaneous optimization of novel metallization schemes, new materials, circuit and system level approaches are required.
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