On the mechanism of the vapor etching of diamond wire sawn multi-crystalline silicon wafers for texturing

Vapour-etching-based porous silicon: a new approach

M. Saadoun, N. Mliki, H Kaabi et al. · Thin Solid Films · 2002 · 92 citations

Engineering, Materials Engineering, Materials Science +14

Textural development of SiC and diamond wire sawed sc-silicon wafer

B. Meinel, T. Koschwitz, J. Acker · Energy Procedia · 2012 · 76 citations · Full text

Engineering, Materials Engineering, Materials Science +17

On the nature and removal of saw marks on diamond wire sawn multicrystalline silicon wafers

Wenhao Chen, Xiaomei Liu, Miao Li et al. · Materials Science in Semiconductor Processing · 2014 · 75 citations

Engineering, Materials Engineering, Materials Science +11

Comparison of diamond wire cut and silicon carbide slurry processed silicon wafer surfaces after acidic texturisation

B. Meinel, T. Koschwitz, C. Blocks et al. · Materials Science in Semiconductor Processing · 2014 · 52 citations

Engineering, Materials Engineering, Materials Science +11

Determination of the impact of the wire velocity on the surface damage of diamond wire sawn silicon wafers

Sindy Würzner, Annemarie Falke, Rajko Buchwald et al. · Energy Procedia · 2015 · 39 citations · Full text

Engineering, Materials Engineering, Materials Science +17