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(Invited) Current and Future Applications of ALD in Micro-Electronics
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2011
Year
Materials ScienceAluminium NitrideElectrical EngineeringSlow Deposition RateEngineeringElectronic EngineeringSurface ScienceApplied PhysicsSemiconductor Device FabricationPlasma Enhanced AldFuture ApplicationsChemical DepositionPulsed Laser DepositionMicroelectronicsPlasma EtchingPlasma ProcessingChemical Vapor DepositionAtomic Layer Deposition
This paper describes the status of current and future applications of Atomic Layer Deposition (ALD) and Plasma Enhanced ALD (PEALD) in the field of Micro-electronics. Substantial expansion of the ALD market is expected in the coming decade, both in IC manufacturing, but also in adjacent non-IC applications. Several techniques will be described that work around the relatively slow deposition rate of ALD.