Effects of hole traps on the temperature dependence of current collapse in a normally-OFF gate-injection transistor

Abstract

Abstract Kinetic studies on the current collapse of a normally-OFF AlGaN/GaN heterostructure gate-injection transistor (GIT) subject to current collapse have been performed above room temperature. The current collapse becomes more severe as the temperature increases, for which we clarified the physical mechanism based on a device simulation study that the hole traps in the epilayer play an important role. As the temperature increases, hole emission from the hole traps is stimulated, which causes sharper potential bending on the drain side in the OFF state, leading to more severe current collapse. The detailed dynamics of holes and the resultant energy profiles in the switching are discussed.