Bipolar Resistive Switching Memory Using Cu Metallic Filament in Ge[sub 0.4]Se[sub 0.6] Solid Electrolyte

Abstract

A bipolar resistive switching memory device with a low power operation in a structure is investigated. A high quality solid electrolyte is confirmed by X-ray photoelectron spectroscopy. The resistive memory device with a small via size of has a large threshold voltage of , high resistance ratio of , and good uniformity. The switching mechanisms are due to the Cu metallic filament formation and dissolution from the solid electrolyte under positive and negative biases, respectively, which have been confirmed by high resolution transmission electron microscopy image and energy-dispersive X-ray spectroscopy analysis. The strong Cu filament formation can also be investigated by monitoring the erase voltage and erase current. Good endurance of is obtained. Excellent data retention characteristics at are observed after 24 h of retention time, owing to the strong Cu metallic filament formation in the solid electrolyte.