Japanese Journal of Applied Physics · 2016 · 81 citations · 25 references
EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDevice CharacterizationDevice ReliabilitySemiconductor ReliabilityWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsBias Stress EffectsBias Stress InstabilityBias Temperature InstabilityHot-carrier DegradationNegative Bias Temperature InstabilityPower MosfetsReliability DegradationThreshold Voltage Stability
Abstract This work reports on three important aspects of threshold-voltage instability in SiC power MOSFETs: (1) the threshold-voltage bias-temperature instability observed in commercial devices from two leading manufacturers, (2) a summary of the basic mechanisms driving this instability, and (3) the need for an improved test method for evaluating these devices. Even under significant overstress conditions, no negative threshold-voltage shift was observed in the most-recent-vintage commercial devices from one of the manufacturers during a −15 V, 175 °C negative-bias temperature stress lasting 120 h.
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The nature of the trapped hole annealing process
Aivars J. Lelis, Timothy R. Oldham, H. E. Boesch et al. · IEEE Transactions on Nuclear Science · 1989 · 310 citations