Improving shear strength of Sn-3.0Ag-0.5Cu/Cu joints and suppressing intermetallic compounds layer growth by adding graphene nanosheets

Electronics Without Lead

Yi Li, Kyoung‐sik Moon, C.P. Wong · Science · 2005 · 496 citations

Engineering, Electrical Engineering, Materials Science +14

Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

Iver E. Anderson · Journal of Materials Science Materials in Electronics · 2006 · 209 citations

Natural Sciences, Materials Engineering, Materials Science +14

Single-wall carbon nanotube (SWCNT) functionalized Sn–Ag–Cu lead-free composite solders

V. Kripesh, A.A.O. Tay · Journal of Alloys and Compounds · 2006 · 167 citations

Natural Sciences, Materials Engineering, Materials Science +11

Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solder

Xiangdong Liu, Yong Han, Hongyang Jing et al. · Materials Science and Engineering A · 2012 · 155 citations

Natural Sciences, Materials Engineering, Materials Science +11

Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes

Mui Ling Sharon Nai, Jun Wei, Manoj Gupta · Materials Science and Engineering A · 2006 · 153 citations

Natural Sciences, Materials Engineering, Materials Science +14