Concepedia

Yong Han

YH

26

Publications

877

Citations

16

H-Index

2009

Active since

Affiliations

Institute of Microelectronics(Current)

Agency for Science, Technology and Research

Nanyang Technological University

Tianjin University

Singapore Institute of Manufacturing Technology

Yong Han is an author at Institute of Microelectronics specializing in engineering, electronic packaging, and thermal engineering.

Top concepts

EngineeringElectronic PackagingMicroelectronicsThermal EngineeringHeat TransferElectrical EngineeringComputer EngineeringThermal ManagementMicrofabricationMechanical Engineering

Publications per year

2009–2022

26

Publications

26

High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material

Manuela Loeblein, Siu Hon Tsang, Matthieu Pawlik et al. · ACS Nano · 2017 · 190 citations · Full text

Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solder

Xiangdong Liu, Yong Han, Hongyang Jing et al. · Materials Science and Engineering A · 2012 · 153 citations

Enhancement of Hotspot Cooling With Diamond Heat Spreader on Cu Microchannel Heat Sink for GaN-on-Si Device

Yong Han, Boon Long Lau, Xiaowu Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 52 citations · Full text

Engineering, Liquid Metal Cooling, Energy Efficiency +17

Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices

Yong Han, Boon Long Lau, Gongyue Tang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2015 · 48 citations

Engineering, Gan Devices, Thermal Modeling +17

Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices

Yong Han, Boon Long Lau, Xiaowu Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 48 citations · Full text

Engineering, Heat Transfer Process, Advanced Packaging (Semiconductors) +16

Rows per page

1–5 of 26