Concepedia

Author

Yong Han

Institute of MicroelectronicsORCID

Also Known As

Han Yong, Han, Yushuo, Y D Han, Y. D. Han, Y. Han, Y.D. Han, Yaowei Han, Yaoxian Han, Yichen Han, Yike Han

99

Publications

1.1K

Citations

16

H-Index

65

Concepts

All Affiliations

Institute of MicroelectronicsAgency for Science, Technology and ResearchNanyang Technological UniversityTianjin UniversitySingapore Institute of Manufacturing Technology
YH

About

Yong Han is an author at Institute of Microelectronics specializing in engineering, electronic packaging, and thermal engineering.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

15

22

509

2

Computer Engineering

11

12

241

3

Applied Physics

4

4

140

4

Chemical Engineering

1

1

27

5

Computer Science

1

1

14

Yong Han

×

26

Publications

877

Citations

16

H-Index

YearCitations

High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material

Manuela Loeblein, Siu Hon Tsang, Matthieu Pawlik,

ACS Nano

2017

190

Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solder

Xiangdong Liu, Yong Han, Hongyang Jing,

Materials Science and Engineering A

2012

153

Enhancement of Hotspot Cooling With Diamond Heat Spreader on Cu Microchannel Heat Sink for GaN-on-Si Device

Yong Han, Boon Long Lau, Xiaowu Zhang,

IEEE Transactions on Components Packaging and Manufacturing Technology

2014

52

Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices

Yong Han, Boon Long Lau, Gongyue Tang,

IEEE Transactions on Components Packaging and Manufacturing Technology

2015

48

Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices

Yong Han, Boon Long Lau, Xiaowu Zhang,

IEEE Transactions on Components Packaging and Manufacturing Technology

2014

48

Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling

Yong Han, Boon Long Lau, Gongyue Tang,

IEEE Transactions on Components Packaging and Manufacturing Technology

2016

31

Effect of graphene nanosheets on the corrosion behavior of Sn–Ag–Cu solders

Lianyong Xu, Zhenggrong Zhang, Hong Yang Jing,

Journal of Materials Science Materials in Electronics

2015

27

Package-Level Microjet-Based Hotspot Cooling Solution for Microelectronic Devices

Yong Han, Boon Long Lau, Xiaowu Zhang

IEEE Electron Device Letters

2015

25

A modified constitutive model for creep of Sn–3.5Ag–0.7Cu solder joints

Yong Han, Hongyang Jing, Mui Ling Sharon Nai,

Journal of Physics D Applied Physics

2009

25

Package-level Si-based micro-jet impingement cooling solution with multiple drainage micro-trenches

Yong Han, Boon Long Lau, Hengyun Zhang,

2014

23

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