Boon Long Lau

Enhancement of Hotspot Cooling With Diamond Heat Spreader on Cu Microchannel Heat Sink for GaN-on-Si Device

Yong Han, Boon Long Lau, Xiaowu Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 54 citations · Full text

Engineering, Electrical Engineering, Materials Engineering +17

Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices

Yong Han, Boon Long Lau, Gongyue Tang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2015 · 50 citations

Engineering, Electrical Engineering, Materials Science +17

Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices

Yong Han, Boon Long Lau, Xiaowu Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 49 citations · Full text

Engineering, Materials Engineering, Mechanical Engineering +17

TSV Cu Filling Failure Modes and Mechanisms Causing the Failures

Jae Woong Choi, Ong Lee Guan, Yingjun Mao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 38 citations

Engineering, Electrical Engineering, Materials Engineering +16

Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling

Yong Han, Boon Long Lau, Gongyue Tang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 31 citations

Engineering, Mechanical Engineering, Computational Fluid Dynamics +15