IEEE Transactions on Components Packaging and Manufacturing Technology · 2015 · 89 citations · 5 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsPower ElectronicsVlsi DesignChip PackagingHigh-frequency Power ConversionIntegrated Circuit DesignPower ManagementProcessor Core DesignVoltage RegulatorsFlip-chip PackagingInductor DesignInductorsIntegrated Voltage Regulator DesignPackaging For High-frequency DevicesPackaging For Power DevicesSwitching Voltage RegulatorsVoltage Regulator Integration
Intel fourth-generation and fifth-generation Core microprocessors are powered by high-frequency integrated switching voltage regulators. The inductors required to implement these regulators are constructed using the routing layers of conventional organic flip chip packaging. This paper provides an overview of the construction of these inductors including representative results from production packages. Measured inductors reported in this paper span from 1 to 6.7 nH under 2.4 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> and achieve Q of up to 24 at 140 MHz (the switching frequency).
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S. Natarajan, M. Agostinelli, Sheikh A. Akbar et al. · 2014 · 532 citations
Engineering, Computer Engineering, Electrical Engineering +16
Haswell: A Family of IA 22 nm Processors
Nasser Kurd, Muntaquim Chowdhury, Edward A. Burton et al. · IEEE Journal of Solid-State Circuits · 2014 · 78 citations