Precision Alignment Packaging for Microsystems With Multiple Fluid Connections

Abstract

Abstract The application of microfluidic Microsystems to solve real world problems depends on effective packaging techniques. In this paper, we report on packaging methods that allow the connection of multiple fluid lines to a microfluidic chip. Eight different fluid connections are made in a 5 mm square area (100 connections possible) using a flip chip aligner/bonder with precise alignment on the order of 10 microns between holes (1 micron precision possible). The critical fluid connections are made using 0.002 inch thick double sided adhesive tape and are shown to hold greater than 20 atm of pressure without leaking. The packaging flow manifold and assembly methods are suitable for inexpensive mass production and are compatible with existing electronics packaging technologies.