Thermal transient characterization of semiconductor devices with multiple heat sources—Fundamentals for a new thermal standard

Compact thermal models for electronic systems

Mohamed Nabil Sabry · IEEE Transactions on Components and Packaging Technologies · 2003 · 122 citations

Electrical Engineering, Linear Systems, Engineering +15

Determining partial thermal resistances with transient measurements, and using the method to detect die attach discontinuities

M. Rencz, V. Székely, Arianna Morelli et al. · 2003 · 77 citations

Engineering, Thermal Transient Measurements, Measurement +24

Thermal transient characterization methodology for single-chip and stacked structures

Oliver Steffens, Péter Szabó, Michael Lenz et al. · 2005 · 59 citations

3D Ic Architecture, Electrical Engineering, Chip-scale Package +14

Thermal analysis of layered electronic circuits with Green's functions

Marcin Janicki, Gilbert De Mey, Andrzej Napieralski · Microelectronics Journal · 2006 · 32 citations

Compact thermal modeling for packaged microprocessor design with practical power maps

Zao Liu, Sheldon X.-D. Tan, Hai Wang et al. · Integration · 2013 · 27 citations

Microprocessor Design, Hardware Modeling, Engineering +16