Atomic layer deposition of MoS₂ thin films

Abstract

Atomic layer deposition (ALD) was used to grow thin films of MoS2 over 5 × 5 cm areas of silicon oxide coated silicon wafers. Smooth, uniform, and continuous films were produced over a temperature range of 350 °C–450 °C. The as-grown films were analyzed using x-ray photoelectron spectroscopy, Raman spectroscopy, photoluminescence, and x-ray diffraction. Electrical characteristics of the films were evaluated by fabricating a back gated field effect transistor. These analyses indicate that ALD technique can produce large area, high quality MoS2 films.