2004 · 30 citations · 0 references
EngineeringComputer EngineeringElectrical EngineeringLow-power DesignMicroelectronicsSemiconductor DevicesCmos Circuit DesignComplementary Metal-oxide-semiconductor TechnologyElectron Beam LithographyIntegrated Circuit DesignMetal-oxide-semiconductor Field-effect TransistorsSemiconductor Device MaterialsCmos Fabrication ProcessesCmos ScalingCopper MetallizationDevice FabricationMemory Circuit DesignMetallizationOptical LithographyOxide Doping
This work highlights a 65 nm CMOS technology platform for low power and general-purpose applications. A 6-T SRAM cell size of 0.69 /spl mu/m/sup 2/ with a 45 nm gate length is demonstrated. Electrical data of functional SRAM bit-cell is presented at V/sub dd/=0.9 Volt using a conventional nitrided gate oxide dielectric. A comparison between offset spacer and PLAsma Doping (PLAD) is made for the transistor characteristics with very promising V/sub th/-L/sub d/ and V/sub th/-W/sub d/ profiles measured. Lithography employed a combination of both optical lithography and e-beam imaging. The BEOL integration used a conventional low K dielectric with copper metallization.