Measurements of displacement fields on packaging components under mechanical and thermal load allow to analyse actual material behaviour. Strain distributions in components and assemblies, i.e. consequently locations of crucial strain and stress are determined. The microDAC method bases on algorithms of local object structure tracking in images obtained from optical, laser scanning and electron scanning microscopy. Measured deformation fields can be utilised for design optimisation, proper material selection and processing, as well as for verification of finite element simulations.
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