Optoelectronic packaging using silicon surface-micromachined alignment mirrors

Abstract

We describe a batch-assembled optoelectronic packaging technology based on silicon surface-micromachined alignment mirrors and demonstrate that these mechanical structures have the functionality, stability and accuracy required for active semiconductor laser-to-filter (single mode) coupling. In initial experiments, we measure an open-loop position accuracy of 0.2 μm, and we achieve repeatable 45% coupling efficiency with good mechanical stability.