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Bond‐Strength Measurements Related to Silicon Surface Hydrophilicity

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1992

Year

Abstract

The hydrophilicity level of commonly used surface treatments prior to silicon fusion bonding has been measured and related to a resulting bond strength. The necessity of hydrophilic silicon surfaces to yield a strong bond has been questioned, even counter‐proved. The strongest bonds measured were for hydrophobic, wafers annealed at 800°C.