IEEE Transactions on Electron Devices · 2008 · 79 citations · 21 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesSensorsCmos Circuit DesignDevice CharacterizationDevice ModelingDevice ReliabilityIntegrated Circuit DesignSemiconductor ReliabilityCmos ReliabilityRelaxation Time Measurements
We evaluate the performance of a novel fast characterization methodology for NBTI and PBTI measurements. We show that the use of a programmable PCI card in combination with linear current amplifiers provides the following means: (a) to perform short BTI stresses down to ~ 30 mus; (b) to perform fast sensing with delay times t <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">delay</sub> ~ 30 mus and a voltage resolution of ~ 1 mV; and (c) to use arbitrary programmable stress-and-sense sequences covering many decades in time. We used the fast PCI card-based measurement system for fast NBTI-relaxation measurements in SiON/poly-Si gate stacks, as well as for a systematic study of PBTI relaxation with HfO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> / TiN gate stacks. We show for the first time that the V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">t</sub> relaxation after PBT stress in nFETS with HfO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> /TiN gate stacks and the V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">t</sub> relaxation after NBT stress in pFETs with SiON/poly-Si gate stacks exhibit strong similarities: We found the time dependence of both types of relaxation to exhibit to first order a log(t) dependence over seven orders of magnitude in time, suggesting that both phenomena are governed by charge removal by tunneling and that tunneling front-based modeling may be used to quantify the observations.
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