2002 · 16 citations · 3 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsMicrowave EngineeringSemiconductor DevicesChip PackagingIntegrated Circuit DesignMicrostrip CircuitsMicrowave Integrated CircuitsMicrowave Network AnalysisVery-large-scale Integration LayoutFlip-chip BondingFlip-chip PackagingHigh-speed Circuit DesignHigh-speed Cmos DesignInterconnect ParasiticsMicrostrip Circuit DesignMicrostrip Integrated CircuitsPackage Parasitics
An inverted microstrip line IC structure for ultra high-speed applications is proposed. It allows a a very low-parasitic-impedance module with a flip-chip bonding, a small IC size, and performance improvements for high-speed digital ICs.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
3
Three-dimensional passive circuit technology for ultra-compact MMICs
Makoto Hirano, Kenjiro Nishikawa, Ichihiko Toyoda et al. · 2002 · 16 citations