Hybrid Silicon Laser Technology: A Thermal Perspective

Abstract

In this paper, the hybrid silicon laser integration platform is analyzed from a thermal perspective. Key laser performance limitations are identified under high temperature and high electrical power operating conditions. Particular attention is paid to the low thermal conductivity buried oxide layer that is utilized for optical confinement. A novel approach is presented and demonstrated to reduce the effect of the buried oxide and its application to a variety of thermally limited hybrid silicon devices is discussed.