3D-Assembly of Molded Interconnect Devices with standard SMD pick & place machines using an active multi axis workpiece carrier

Abstract

Three-dimensional circuit carriers offer an enormous potential to enhance the functionality and simultaneously miniaturize the overall size of electronic systems. These Molded Interconnect Devices (3D-MID) are manufactured by injection molding and structuring of 3D circuitry. But for the assembly of electronic components (like resistors, capacitors, IC etc.) on MID no standardized and cost-efficient production equipment is available. To overcome this challenge a method to extend the kinematics of SMD (surface mounted device) pick & place machines by automated multi axis workpiece carriers was developed. This manipulator is designed to realize the 3D-assembly of MID in SMD pick & place machines. By the extended kinematics, the placement of electronic components on inclined process areas of MID is enabled. The first result is a prototype, that approves the feasibility of the kinematic concept and the integration of the manipulator into pick & place machines. This article gives at first an overview of the MID technology with its manufacturing processes and innovative applications. The main requirements for assembling 3D-MID are discussed and the developed manipulator is presented. Finally two strategies for the integration of the manipulator into production lines and a comparison of different assembly solutions are described.