Flexible shear stress sensor skin for aerodynamics applications

Abstract

Packaging for a large distributed sensing system is a challenging topic. Using flexible skin technology solves many of these problems. Combining with the newly developed backside contact technique, sensor packaging is made even easier by completely avoiding the fragile bonding wires. This paper describes the improved flexible MEMS technology and its application to the fabrication and packaging of practical shear stress sensor skins. An airflow separation detection system including these skins, MOSIS bias circuits and a data acquisition unit has been successfully tested in windtunnel and is being used for the aerodynamic study of a MEMS controlled super-maneuverable low-altitude unmanned aerial vehicle (UAV).