A new approach for opto-electronic/MEMS packaging

Abstract

Opto-electronic and MEMS packages require unique capabilities over and above traditional hermetic multichip modules. In addition to hermeticity or vacuum atmosphere, opto-electronic systems require direct input/output of optical, RF and other sensitive signals through the package using fiber-optic, coaxial and/or other interconnection approaches. Precise optical component alignment and accurate thermal management is critical to achieve component and system performance capabilities. Furthermore, to improve MEMS functionality, performance and service life, a suitable getter and/or dopant is required compatible with the hermetic/vacuum package atmosphere. The getter/dopant is usually activated after achieving hermetic or vacuum atmosphere. A comprehensive MEMS packaging approach is introduced based on photo-patterned thick film metallization, LTCC, brazing technology and new feed-through approaches. The new methodology incorporates most reported MEMS packaging requirements for proven performance, reliability, low cost and mass production capabilities.