Investigations regarding Through Silicon Via filling for 3D integration by Periodic Pulse Reverse plating with and without additives - Concepedia

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Investigations regarding Through Silicon Via filling for 3D integration by Periodic Pulse Reverse plating with and without additives

57

Citations

3

References

2010

Year

Lutz Hofmann, Ramona Ecke, Stefan E. Schulz

Microelectronic Engineering

Materials SciencePhotonicsSilicon Via FillingEngineeringPeriodic Pulse ReverseMicrofabricationFabrication TechniqueApplied Physics3D PrintingMicroelectronicsOptoelectronics3D Integration

References

	Year	Citations

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