Automatic detection of spatial signature on wafermaps in a high volume production

F. Duvivier

2003 · 12 citations · 4 references

Concepts

Abstract

In high volume production, it is important to have a fast response time to yield loss mechanisms. This paper presents a way to detect spatial yield loss on wafers. A procedure automatically computes and provides a summary of signatures taking into account all of the processed wafer. This reduces manual manipulation of data, providing a faster response time.

References

4