2011 · 232 citations · 37 references
EngineeringComputer EngineeringComputer ScienceComputer ArchitectureEmbedded SystemsMemoryBlock StorageCachingMemory DevicesMemory HierarchyMemory Hierarchy DesignMemory Subsystem DesignCache DesignCache Hierarchy DesignCache Memory DesignEmbedded Memory IntegrationEmbedded Systems IntegrationMain Memory OrganizationMulticore ArchitecturesMulticore Systems
Die-stacking technology enables multiple layers of DRAM to be integrated with multicore processors. A promising use of stacked DRAM is as a cache, since its capacity is insufficient to be all of main memory (for all but some embedded systems). However, a 1GB DRAM cache with 64-byte blocks requires 96MB of tag storage. Placing these tags on-chip is impractical (larger than on-chip L3s) while putting them in DRAM is slow (two full DRAM accesses for tag and data). Larger blocks and sub-blocking are possible, but less robust due to fragmentation.
37
Scott Rixner, William J. Dally, Ujval J. Kapasi et al. · 2000 · 966 citations · Full text
The M5 Simulator: Modeling Networked Systems
Nathan Binkert, Ronald Dreslinski, L. Hsu et al. · IEEE Micro · 2006 · 846 citations
Die Stacking (3D) Microarchitecture
Bryan Black, Daniel Pantuso, Paul A. Reed et al. · 2006 · 599 citations