Journal of the American Ceramic Society · 1993 · 92 citations · 29 references
Mismatched Sintering KineticsEngineeringMechanical EngineeringThermal ProcessesCeramic PowdersStructural MaterialsGold FilmSolidificationCeramic TechnologyMaterials ScienceCeramicsSintering ProcessCeramic MaterialStructural CeramicSinteringMechanical PropertiesMaterials CharacterizationApplied PhysicsCeramics MaterialsCeramic SynthesisMetal-ceramic SystemsLinear Shrinkage ProfilesEngineering CeramicMechanics Of Materials
Linear shrinkage profiles of an unconstrained gold thick film material and a low ‐tempearture cofireable glass‐ceramic (LTCC) green tape were measured using a noncontact optical technique. A laser beam scans across a sample, at various times during the sintering process. The unconstrained sintering kinetics of the gold film were found to differ significantly from those of the LTCC tape. The densification of the gold film was nearly completed before the LTCC began to densify. The development of camber (warpage) during consintering of a gold/LTCC composite structure was monitored and recorded with a video camera. This camber development is analysed based on the viscous constitutive relations for porous based on the viscous constitutive relations for porous sintering bodies. The mismatched sintering kinetics of the two materials lead to the development of in‐plane stresses in the two constituents of the composite structure as one material being constrained from composite structure as one material being constrained of the composite structure as one material being constrained from sintering by the other. The resulting camber during the consintering process is explained by the development of these stresses.
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Alfred Seeger · Journal of the Franklin Institute · 1966 · 808 citations
Materials Science, High Temperature Materials, Engineering +6
Relaxation in glass and composites
D. E. Packham · Composites Science and Technology · 1987 · 557 citations
Principles of Electronic Packaging
D. P. Seraphim, Ronald C. Lasky, Che‐Yu Li et al. · Journal of Electronic Packaging · 1989 · 354 citations
Advanced Packaging, Materials Science, Chip-scale Package +4