IEEE Photonics Technology Letters · 1992 · 34 citations · 12 references
EngineeringElectrical EngineeringMaterials ScienceOpticsOptoelectronicsPhotonicsIntegrated Circuit DesignIntegrated Circuit FabricationIntegrated OpticsIntegrated PhotonicsOptical InterconnectsPhotonic Integrated CircuitsFlip-chip BumpingIntegrated LasersIntegrated Photonic DevicesMicrolasersMonolithic ArchitecturePrecisionPrecision AlignmentSolder Pastes
The bonding of a monolithic array of surface-emitting microlasers onto a glass substrate that contains a matching array of microlenses and mirrors is reported. The bonding was achieved by flip-chip solder bump bonding using indium as the solder material. The alignment precision is within +or-2 mu m. The optical substrate provides a simple interconnection scheme that routes the light from each laser to well defined output positions.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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Optical interconnections for VLSI systems
Joseph W. Goodman, F. J. Leonberger, Sun-Yuan Kung et al. · Proceedings of the IEEE · 1984 · 1K citations
Engineering, Computer Engineering, Electrical Engineering +15
Planar integration of free-space optical components
Jürgen Jahns, Alan Huang · Applied Optics · 1989 · 271 citations