Publication | Closed Access
Impact of metal gate electrode on Weibull distribution of TDDB in HfSiON gate dielectrics
13
Citations
4
References
2009
Year
Unknown Venue
Wide-bandgap SemiconductorEngineeringDc StressMetal Gate ElectrodeSemiconductor DeviceNanoelectronicsElectronic EngineeringWeibull DistributionLarge BetaDevice ModelingElectrical EngineeringPhysicsBias Temperature InstabilityTime-dependent Dielectric BreakdownMicroelectronicsHfsion Gate DielectricsElectrochemistryApplied PhysicsCondensed Matter PhysicsSlope ParameterElectrical Insulation
The slope parameter of Weibull plot of Tbd, beta, strongly depends on gate electrode material for metalgate/HfSiON gate stacks in n-FETs. Furthermore beta of Tbd under bipolar stress is larger than that under DC stress. From these results, it is found that the balance of injected carriers is strongly related to beta in terms of the origin of large beta for metal-gate/high-k.
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