Flow time measurements for underfills in flip-chip packaging

Abstract

Flow time is a key material property for underfill materials in flip-chip applications. In this paper, we will discuss how to use flow time testing for underfill flow evaluation and material screening. The flow time of several underfills was measured at elevated temperatures using test pieces made from glass microscope slides. The material properties impacting underfill flow, such as viscosity, contact angle, and surface tension, were also experimentally measured and used to calculate estimated flow times using the Washburn equation. Empirical and calculated flow times were compared. The effects of channel width and flow distance on flow time were also studied. Additionally, the effect of a tilted stage on flow time, epoxy tongue, and void formation was evaluated.