Jinlin Wang - Concepedia

Author

Jinlin Wang

Intel (United States)ORCID

Also Known As

Jin-Lin Wang, Jin-lin WANG, Jin-lin Wang, Jinlin Wang, Wang, Jinlin

Publications

1.8K

Citations

H-Index

Concepts

All Affiliations

Intel (United States)Shenzhen Polytechnic University Institute of Physics University of Chinese Academy of Sciences Guangzhou Medical University

About

Jinlin Wang is an author at Intel (United States) specializing in engineering, materials science, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	16	1.3K
2	Applied Physics	5	5	905
3	Medicine	3	3	50
4	Education	1	1	11
5	Natural Sciences	1	1	11

Jinlin Wang

Publications

1.5K

Citations

H-Index

Page 1

	Year	Citations
Measurements of nanofluid viscosity and its implications for thermal applications Ravi Prasher, David Song, Jinlin Wang, Applied Physics Letters EngineeringFluid MechanicsNanofluidsThermal ConductivityRheological Measurement	2006	792
Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials Ravi Prasher, Jim Shipley, Suzana Prstic, Journal of Heat Transfer Materials ScienceEngineeringMechanical EngineeringPolymer ScienceThermal Resistance	2003	144
An optimization-based algorithm for job shop scheduling Jihua Wang, Peter B. Luh, Xing Zhao, Sadhana Mathematical ProgrammingEngineeringIndustrial EngineeringScheduling ProblemProduction Scheduling	1997	65
Translational Nanotherapeutics Reprograms Immune Microenvironment in Malignant Pleural Effusion of Lung Adenocarcinoma Zhenhuan Song, Weizhan Luo, Haichong Zheng, Advanced Healthcare Materials	2021	56
Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle Jinlin Wang Microelectronics Reliability Materials ScienceFlip ChipEngineeringAdvanced Packaging (Semiconductors)Flexible Electronics	2002	53
Multinary alloying for facilitated cation exchange and suppressed defect formation in kesterite solar cells with above 14% certified efficiency Jiangjian Shi, Jinlin Wang, Fanqi Meng, Nature Energy Materials ScienceMaterials EngineeringChemical EngineeringCation ExchangeEngineering	2024	52
The effects of rheological and wetting properties on underfill filler settling and flow voids in flip chip packages Jinlin Wang Microelectronics Reliability Underfill Filler SettlingEngineeringChip On BoardMechanical EngineeringChip Attachment	2007	50
Pd(II)/Pd(IV) redox shuttle to suppress vacancy defects at grain boundaries for efficient kesterite solar cells Jinlin Wang, Jiangjian Shi, Kang Yin, Nature Communications	2024	39
Flow time measurements for underfills in flip-chip packaging Jinlin Wang IEEE Transactions on Components and Packaging Technologies Materials ScienceFlow TimeEngineeringChip-scale PackageMicrofabrication	2005	33
Determination of trace water contents of organic solvents by gas chromatography-mass spectrometry-selected ion monitoring XU Bai-qiu, Changquan Rao, Shufen Cui, Journal of Chromatography A Environmental ChemistryChemical EngineeringEngineeringOrganic SolventsChemical Measurement	2018	26

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