Use of laser lift-off for flexible device applications

Abstract

This paper presents an approach of “film separation” and “transfer” to fabricating functional films or devices on polymeric substrates. For either a ferroelectric La-doped Pb(Zr,Ti)O3, PLZT thin film or a ZnO thin film, using laser lift-off (LLO), film separation from the transparent rigid substrate (sapphire or glass) was achieved. The film transfer to a polymeric receptor substrate was obtained by laminating the polymeric substrate on the film stack prior to LLO. The introduction of a sacrificial layer between the film and the substrate mostly resolved concerns to induce damages during LLO. Electrical testing of the films before and after LLO demonstrated the film properties on the original substrate were satisfactorily retained even for the transferred films on the polymeric substrate.