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Embedded SiGe S/D PMOS on thin body SOI substrate with drive current enhancement

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2005

Year

Abstract

We report for the first time PMOS drive current enhancement with in-situ boron doped SiGe incorporation in recessed S/D regions for devices built on thin body SOI substrate. For P-channel PD-SOI devices with 450 A silicon on insulator and 38nm gate length, 35% linear drain current enhancement and 20% saturation drain current improvement have been achieved with this approach. Device integration and performance improvement are discussed below.