IEEE Transactions on Microwave Theory and Techniques · 1997 · 48 citations · 11 references
EngineeringComputer EngineeringElectrical EngineeringCircuit TheoryComputational ElectromagneticsMicroelectronicsDevice ModelingIntegrated Circuit DesignInterconnect ArchitectureInterconnect DesignInterconnect TechnologyVery-large-scale Integration LayoutCapacitanceDomain DecompositionInterconnect Capacitance ModelingInterconnect ModelingParameter ExtractionThree-dimensional Integrated Circuit InterconnectsVery-large-scale IntegrationVery-large-scale Integration (Vlsi) Design
In this paper, the domain-decomposition method (DDM) has been used to extract the capacitance matrices of multilayered three-dimensional (3-D) interconnects in very-large-scale integration (VLSI) circuits. Different subdomains are analyzed separately, so the most efficient method can be chosen for every subdomain. Therefore, the DDM can greatly reduce the algorithm complexity and provide a good platform for the development of combining methods. Numerical results show that the computing time and memory size used by the DDM are more than ten times less than those used by Ansoft's Maxwell SpiceLink-and more importantly, they are unrelated to the thickness of the pure dielectric layers.
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