IEEE Transactions on Advanced Packaging · 2002 · 32 citations · 3 references
EngineeringManufacturing EngineeringManufacturing ProcessesOptoelectronicsPackaging DesignFiber OpticsLaser Beam WeldingLaser DiodesLaser Material ProcessingSemiconductor LasersWelding ProcessesLaser Beam AlignmentLaser WeldingLaser Welding DistortionOptical PackagingOptical System AlignmentWeld DistortionWelding Distortion
Welding-induced-alignment-distortion (WIAD) is a serious issue in fiber-optic component attachment using laser welding, which can significantly affect the packaging yield. Elimination or minimization of WIAD is expected to be possible if the laser welding process and all relevant packaging parameters can be optimized. The effect of laser welding sequence on WIAD for butterfly laser diode packages is reported for the first time in this work. The results demonstrate that WIAD deduction can be as high as 96% if an appropriate welding sequence is employed.
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