Ultra-thin, flexible electronics

Abstract

Ultra-thin, flexible electronics are advantageous for integration into biomedical sensors, wearable electronics, multifunction surfaces and low profile applications. Although flexible interconnects have been successfully demonstrated for these applications [1], the embedding of thinned, flexible semiconductor die will greatly enhance the application of this technology. Die thinning, thin multilayer substrates and the elimination of solder joints are required to meet the thickness targets for these applications. A process sequence has been developed to achieve final thicknesses of 35–75µm.