Concepedia

E. Jan Vardaman

EJ

5

Publications

106

Citations

5

H-Index

2004

Active since

Affiliations

21st Century Technologies (United States)(Current)

E. Jan Vardaman is an author at 21st Century Technologies (United States) specializing in microelectronics, computer engineering, and engineering.

Top concepts

EngineeringMicroelectronicsComputer EngineeringElectronic PackagingComputer ArchitectureAdvanced PackagingElectrical EngineeringMicrofabricationParallel ComputingPackage Integration

Publications per year

2004–2014

5

Publications

5

Developments in 2.5D: The role of silicon interposers

Timothy G. Lenihan, Linda Matthew, E. Jan Vardaman · 2013 · 35 citations

Engineering, Device Integration, Computer Architecture +19

Cost comparison for flip chip, gold wire bond, and copper wire bond packaging

Chet Palesko, E. Jan Vardaman · 2010 · 29 citations

Advanced Packaging, Materials Science, Electrical Engineering +15

Worldwide Perspectives on SiP Markets: Technology Trends and Challenges

Timothy G. Lenihan, E. Jan Vardaman · 2006 · 20 citations

Engineering, Computer Architecture, Service Delivery Platform +21

New developments in stacked die CSPs

E. Jan Vardaman, Linda Matthew · 2004 · 12 citations

Flip Chip, 3D Ic Architecture, Electrical Engineering +13

Cost and yield analysis of multi-die packaging using 2.5D technology compared to fan-out wafer level packaging

Chet Palesko, Amy Palesko, E. Jan Vardaman · 2014 · 10 citations

Total Cost, Engineering, Cumulative Yield Loss +17

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