Publication | Closed Access
Study of tantalum oxide thin film capacitors on metallized polymer sheets for advanced packaging applications
27
Citations
4
References
1997
Year
EngineeringBreakdown Field StrengthHybrid CapacitorThin Film Process TechnologyConducting PolymerChemical EngineeringPrinted ElectronicsElectronic PackagingMetallized Polymer SheetsThin Film ProcessingMaterials ScienceMaterials EngineeringElectrical EngineeringElectrochemical Double Layer CapacitorAdvanced PackagingFlexible ElectronicsSurface ScienceThin FilmsAdvanced Packaging ApplicationsSurface TopographyThin Film Capacitors
Tantalum oxide thin film capacitors were fabricated on metallized polyimide sheet substrates and tested. It was found that the substrates' surface topography has a strong influence on the electrical properties and yields of the thin film capacitors. The leakage current density and breakdown field strength of the capacitors are qualitatively correlated to the amount and degree of surface irregularities on the substrates, which were analyzed using scanning electron microscopy (SEM), atomic force microscopy (AFM), and profilometry. It was demonstrated that Benzocyclobutene (BCB) can be used to planarize the surface irregularities and to improve the capacitor yield and performance. The importance of choosing the right substrate materials for thin film capacitor fabrication is also discussed.
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