IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 27 citations · 4 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsSurface ScienceThin FilmsPolymer SurfacesPolymer Thin FilmsThin Film Electrical PropertiesThin Film Surface MorphologyThin-film DepositionThin-film MaterialsAdvanced PackagingBreakdown StrengthCapacitorsCurrent DensityElectrical Breakdown StrengthElectrical PropertiesLeakage CurrentSubstrate Materials
Tantalum oxide thin film capacitors were fabricated on metallized polyimide sheet substrates and tested. It was found that the substrates' surface topography has a strong influence on the electrical properties and yields of the thin film capacitors. The leakage current density and breakdown field strength of the capacitors are qualitatively correlated to the amount and degree of surface irregularities on the substrates, which were analyzed using scanning electron microscopy (SEM), atomic force microscopy (AFM), and profilometry. It was demonstrated that Benzocyclobutene (BCB) can be used to planarize the surface irregularities and to improve the capacitor yield and performance. The importance of choosing the right substrate materials for thin film capacitor fabrication is also discussed.
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Tantalum oxide capacitors for GaAs monolithic integrated circuits
M.E. Elta, A. Chu, L.J. Mahoney et al. · IEEE Electron Device Letters · 1982 · 21 citations