A highly flexible manufacturing technique for microelectrode array fabrication

Abstract

A new technique for manufacturing microelectrode arrays is described and assessed. This technique uses wire Electrical Discharge Machining (wire EDM) to form detailed array structures from a single sample of solid metal. Chemical etching can then be used to increase the electrode aspect ratios. Electrode lengths of 5 mm, widths of 40 /spl mu/m, and spacings of 250 /spl mu/m have been fabricated using this technique. Arrays of electrodes of varying lengths can also be fabricated. For intracortical recording applications, the signal paths are isolated from one another by securing an insulating substrate.