Publication | Closed Access
Use of noise thermometry to study the effects of self-heating in submicrometer SOI MOSFETs
43
Citations
6
References
1992
Year
EngineeringNoise ThermometryIntegrated CircuitsSilicon On InsulatorSemiconductor DeviceThermal AnalysisThermodynamicsInstrumentationDevice Island TemperatureSubmicrometer Soi MosfetsDevice ModelingElectrical EngineeringBias Temperature InstabilityThermal TransportSilicon Island TemperatureHeat TransferMicroelectronicsBias ConditionsTemperature MeasurementApplied PhysicsThermal SensorThermal Engineering
The authors report the direct measurement of the silicon island temperature in both long and submicrometer thin-film silicon-on-insulator (SOI) MOSFETs as a function of bias conditions using noise thermometry. They show that the device island temperature increases with drain voltage and that this results in a reduction of drain current. Using standard models of the drain current and velocity/field expression, they show that a thermally induced fall in mobility quantitatively accounts for the loss in drain current drive observed.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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