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The formation of the Schottky barrier at the V/Si interface
38
Citations
11
References
1982
Year
Materials ScienceSemiconductorsElectrical EngineeringV CoverageEngineeringSemiconductor TechnologyCrystalline DefectsSurface ScienceApplied PhysicsV/si InterfaceSchottky BarrierSemiconductor MaterialSemiconductor Device FabricationThin FilmsSilicon On InsulatorEpitaxial GrowthThin Film ProcessingSemiconductor Device
Synchrotron radiation photoemission measurements have been used to study the behavior of the Schottky barrier height φbn and electronic structure of the V/Si interface for both cleaved Si(111)–(2×1) and sputter-cleaned Si(111)–(7×7) surfaces. Although the Schottky barrier height φbn of the clean surface is influenced by surface reconstruction (and by steps), the barrier becomes pinned at low (∠2 Å) V coverage at a position essentially independent of the initial clean surface structure. Formation of the bulk V metal band structure is not complete until ∠30–40 Å V coverage, indicating coverage-dependent structural effects in the growth of the metal film. These effects also seem to produce secondary influences on φbn , which are manifested as a gradual increase of φbn with higher coverage or mild (∠200 °C) annealing. However, upon higher temperature annealing (?350 °C) the trend reverses, with φbn decreasing to a value (∠0.64 eV) characteristic of the bulk VSi2 contact which is formed at 500–550 °C; this change in the behavior of φbn is directly correlated with the onset of atomic mixing across the interface.
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