IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 1997 · 96 citations · 17 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsThermal AnalysisVlsi DesignCmos Circuit DesignDevice SimulationDigital Integrated Circuit DesignIntegrated Circuit DesignIntegrated Circuit DevicesThermal SimulationElectro-thermal CouplingElectro-thermal ModelingElectronic Thermal DesignElectrothermal SimulationSilicon Device SimulationThermal Device SimulationThermal Effects In Integrated CircuitsVery-large-scale Integration (Vlsi) Design
Due to severe thermal problems of today's VLSI integrated circuits the need for reliable and quick thermal, electro-thermal and logi-thermal simulation tools is increasing, In this paper, we discuss the latest advances in the SISSI package (simulator for integrated structures by simultaneous iteration) which is a tool developed originally for analog VLSI design. The improvements include electro-thermal ac and transient simulation and the consideration of the thermal voltage of Si-Al contacts. Furthermore, we introduce a new module of SISSI, LOGITHERM, which is aimed at the self-consistent logic and thermal simulation of large digital VLSI designs. The features of our simulator package are highlighted by simulation examples that are compared in most cases with measurement results.
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