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High Quality P‐Type GaN Deposition on c‐Sapphire Substrates in a Multiwafer Rotating‐Disk Reactor
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1995
Year
Materials ScienceUndoped FilmsElectrical EngineeringWide-bandgap SemiconductorEngineeringSemiconductor TechnologyCrystalline DefectsApplied PhysicsGan Power DeviceMultiwafer Rotating‐disk ReactorThin Film Process TechnologyThin FilmsChemical Vapor DepositionEpitaxial GrowthMocvd TechniqueC‐sapphire SubstratesFlow Rate
Very high quality p‐type thin films have been epitaxially grown on c‐sapphire substrates by the MOCVD technique in a multiwafer rotating‐disk reactor at 1040°C with a buffer layer of ∼200 Å grown at 530°C. The undoped films have a low n‐type background carrier concentration of with an x‐ray of 280 arc‐sec across the 1 in. substrate. Biscyclopentadienyl magnesium was used as the precursor , the p‐dopant. The Mg‐doped wafers retained an excellent surface morphology. In addition, after post annealing in ambient at ∼700°C for an hour, the Hall measurements show carrier concentration depending on flow rate, with a hole mobility of 10–20 cm2/V‐s which is the best mobility for those hole concentrations reported in the literature to date.