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A three-step method for the de-embedding of high-frequency S-parameter measurements
318
Citations
4
References
1991
Year
EngineeringMeasurementProbe PadsSpectrum EstimationEducationPower Electronic SystemsIntegrated CircuitsInterconnect (Integrated Circuits)Electromagnetic CompatibilityThree-step MethodCalibrationElectronic EngineeringComputational ElectromagneticsTimefrequency AnalysisElectronic PackagingInstrumentationStatisticsAdvanced Bipolar TransistorPower Electronic DevicesDevice ModelingElectrical EngineeringInverse ProblemsMicroelectronicsPower ConsumptionSignal ProcessingHigh-frequency MeasurementSpectral AnalysisWaveform Analysis
The authors propose a general method of deembedding S-parameter measurements of the device-under-test (DUT) for which typical parasitics associated with probe pads and interconnect-metal lines can be deembedded from the measurement. The DUT is the analog silicon bipolar junction transistor including the pad and interconnects. This method includes the subtraction of the parasitic shunt y-parameters of the on-wafer open calibration pattern as well as the subtraction of the parasitic series z-parameters on the on-wafer open circuit which are taken from measurements of the short and through circuits. It is demonstrated that the calculated power loss for the pad and interconnect parasitics can be comparable to the power consumption of the advanced bipolar transistor at high frequencies (>or=10 GHz). A knowledge of the magnitude and type of parasitic deembedding circuit elements can aid the device engineer in the analysis of the error associated with deembedding.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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