Aluminum Silicon Carbide (AlSiC) Thermal Management Packaging For High Density Packaging Applications

Abstract

High-density microelectronics require packaging materials and systems that provide superior thermal management and highly functional interconnection schemes for component performance and reliability. Aluminum Silicon Carbide (AlSiC) metal matrix composite (MMC) packages have a unique set of material properties that are ideally suited to thermal management performance, and a functionality that supports high density interconnection microelectronic packaging applications. Furthermore, the AlSiC fabrication and processing technology provides these high performance attributes cost-effectively. The AlSiC coefficient of thermal expansion (CTE) value is compatible with direct IC device attachment allowing for the maximum thermal dissipation into the high thermal conductivity (170 – 200 W/mK) AlSiC package. Additionally, the low material density of AlSiC (3 g/cm 3 ) makes it ideal for weight sensitive applications such as airborne, spaceborne, or portable devices. The AlSiC material and functional electronic packaging geometries are cost-effectively produced using Ceramics Process Systems (CPS) QuickSet™/QuickCast™ net-shape (without machining) fabrication process. Functional packaging features such as feedthrus, sealrings and substrates are incorporated in AlSiC during fabrication using the CPS Concurrent Integration™ technique eliminating the need for additional assembly and brazing (or soldering) operations. The ideal material properties coupled with AlSiC fabrication and Concurrent Integration™ process provide low-cost high performance functional thermal management packaging solutions. This paper will illustrate the AlSiC material/packaging capabilities through examples of High-Density Interconnect (HDI) electronic packaging, which will be discussed in terms of the ultimate component reliability. In addition the AlSiC packaging cost-efficiency will be illustrated through an outline of the AlSiC material/packaging fabrication process which will be contrasted to traditional fabrication and packaging assembly techniques.