Kevin P. Fennessy

Passive alignment optical subassemblies for military/aerospace fiber-optic transmitter/receiver modules

M.W. Beranek, Eric Y. Chan, C.C. Chen et al. · IEEE Transactions on Advanced Packaging · 2000 · 16 citations

Free-space Optical Network, Photonics, Optical Materials +13

Aluminum Silicon Carbide (AlSiC) for Advanced Microelectronic Packages

M.A. Occhionero, Richard W. Adams, Kevin P. Fennessy et al. · 1998 · 15 citations

Engineering, Alsic Coefficient, Wafer Scale Processing +18

Aluminum Silicon Carbide (AlSiC) Thermal Management Packaging For High Density Packaging Applications

M.A. Occhionero, Robert A. Hay, Richard W. Adams et al. · 1999 · 12 citations

Engineering, Thermal Management Packaging, Mechanical Engineering +21

Cost-effective manufacturing of aluminium silicon carbide (AlSiC) electronic packages

M.A. Occhionero, Robert A. Hay, Richard W. Adams et al. · 2003 · 10 citations

Engineering, Industrial Engineering, Alsic Coefficient +17

Aluminum Silicon Carbide (AlSiC) Microprocessor Lids and Heat Sinks for Integrated Thermal Management Solutions

M.A. Occhionero, Robert A. Hay, Richard W. Adams et al. · 2000 · 10 citations

Engineering, Sic Preform, Integrated Circuits +23