IEEE Journal of Solid-State Circuits · 1994 · 23 citations · 8 references
EngineeringComputer EngineeringElectrical EngineeringComputer ArchitectureLow-power DesignSemiconductor DevicesMemory DevicesMemory HierarchyMemory Subsystem DesignData RetentionData Retention RequirementsMemory Circuit DesignProcess Variation ToleranceRetention CharacteristicsSemiconductor Technology
In developing the 256-Mb DRAM, the data retention characteristics must inevitably be improved. In order for DRAM's to remain the semiconductor device with the largest production volume in the 256-Mb era, we must develop a cost effective device with a small chip size and a large process tolerance. In this paper, we propose the BSG (boosted sense-ground) scheme for data retention and FOGOS (folded global and open segment bit-line) structure for chip size reduction. We have fabricated an experimental 256-Mb DRAM with these technologies and obtained a chip size of 304 mm/sup 2/ and a performance of 34 ns access time.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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A 34 ns 256 Mb DRAM with boosted sense-ground scheme
M. Asakura, T. Ohishi, M. Tsukude et al. · 2002 · 23 citations
Engineering, Computer Engineering, Electrical Engineering +14