Focused ion beam microsurgery for electronics

Abstract

Methods of making and breaking connections on an Al conductor test pattern using a focused ion beam (FIB) are demonstrated. Submicrometer dimension connections between crossing conductors separated by oxide were fabricated in 7 s. Resistances of the connections were measured to be 3 Ω and were tested up to 50 mA. Milled cuts in 0.65- µm-thick 10-µm-wide conductors produced open-circuit resistances > 20 MΩ in 300 s. The combined imaging, restructuring, and verification capability of FIB microsurgery is shown.