Concepedia
MRS Proceedings · 2000 · 21 citations · 3 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesThermal AnalysisHigh-temperature MaterialsSemiconductor Device MaterialsThermal DesignDie AttachHigh-temperature ElectronicsSilicon Carbide
3
Thick film hybrid packaging techniques for 500°C operation
J.S. Salmon, Wayne Johnson, Michael J. Palmer · 2002 · 35 citations
Engineering, Electrical Engineering, Materials Science +17
600 C Logic Gates Using Silicon Carbide JFET's
Philip G. Neudeck, Glenn M. Beheim, Carl Salupo · NASA Technical Reports Server (NASA) · 2000 · 26 citations · Full text
Engineering, Aerospace Engineering, Electrical Engineering +17
Electrical characterization of annealed Ti/TiN/Pt contacts on N-type 6H-SiC epilayer
Robert S. Okojie, A.A. Ned, A. D. Kurtz et al. · IEEE Transactions on Electron Devices · 1999 · 12 citations
Engineering, Materials Engineering, Materials Science +17