Millimeter-wave characteristics of flip-chip interconnects for multichip modules

Abstract

Electromagnetic simulation and measurement data of flip-chip transitions are presented. First-order effects are identified and design criteria for millimeter-wave multichip interconnects are derived. Results cover chip detuning and bump geometry as well as simplified modeling. In a coplanar environment, the flip-chip scheme provides interconnects with excellent low-reflective properties. For conductor-backed structures, parasitic modes occur leading to unwanted crosstalk. These effects dominate the behavior so that overall performance of the flip-chip scheme can be evaluated properly only in conjunction with the actual motherboard packaging setup.